: Implementation of dynamic CA techniques significantly reduces memory requirements and increases simulation speed (up to 5x faster than older methods).
: Users can import 2D mask designs in standard formats like CIF, GDSII, and BMP . anisotropic crystalline etch simulation (aces download)
: It supports various etchants like Potassium Hydroxide (KOH) and Ethylene-Diamine Pyrocatechol (EDP) , and can handle different wafer orientations. and can handle different wafer orientations.